Chemical Mechanical Polishing is more commonly known as CMP Polishing. This is the process where the top surface of a wafer is polished with a slurry containing an abrasive grit, suspended within reactive chemical agents. Chemical mechanical polishing (CMP) is a process used to polish and smooth the surface of a material, typically a metallic or semiconductor substrate. It is a combination of mechanical abrasion and chemical etching, in which a polishing pad is used to apply pressure and abrasiv

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