Sputtering - Wikipedia
In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a …
Sputtering technique – Thin film Science and Technology
Sputtering technique (cathodic sputtering) was discovered by English physicist, W. R. Groove in 1852 and developed as a thin film deposition technique by Irving Langmuir in 1920. In order to …
Schematic of sputtering process. Basically the steps of sputtering …
Basically the steps of sputtering process are the following: (i) the neutral gas is ionized by a external power supply, producing a glow discharge or plasma; (ii) a source (the cathode, also...
sputtering emerged and this became known as magnetron sputtering. Magnetron sputtering is a high-rate vacuum coat- ing technique for depositing metals, alloys and compounds onto a …
Introductory Chapter: Basic Theory of Magnetron Sputtering
2018年11月5日 · Schematic diagram of magnetron sputtering. Magnetron sputtering is the collision process between incident particles and targets. Since high-speed sputtering is …
Schematic of the sputtering process. | Download Scientific Diagram
We review the most salient observations and physical principles of knock-on and electronic sputtering and the role of sputtering in several astrophysical settings and applications in …
Schematic diagram of sputtering system. - ResearchGate
Results demonstrate that electrical resistivity measurements are a viable nondestructive measurement technique to determine the phases and presence of precipitates in the film. The …
Sputtering - SpringerLink
2022年8月20日 · Sputtering techniques are of great importance for both academic research and commercial applications. This chapter summarizes the fundamentals of the sputtering process, …
Plasma is only self-sustaining over a range of pressures: typically 1 or 10 mT > P > 100 mT. To understand “Why this pressure range?”, we need to understand what goes on inside a …
So in sputtering, the target material and the substrate is placed in a vacuum chamber. A voltage is applied between them so that the target is the cathode and the substrate is attached to the …