These "bumps" or "balls" are soldered onto the package substrate or the circuit board itself and underfilled with epoxy. The flip chip allows for a large number of interconnects with shorter ...

The benefits of capillary flow underfills on solder joint reliability.

Suss Microtec stepped into the hybrid-bonding market this year with a machine focused on R&D. At Semicon Europe, Bits&Chips ...

IBM first introduced flip chip (FC) technology in 1964 in the solid logic ... The flow of the solder (collapse of the chip-substrate spacing) was controlled during reflow by controlling the solder ...

1 3 in 1992, the electronic packaging industry has witnessed an explosive growth in the research and development efforts devoted to solder-bumped flip chips on low-cost PCB or organic substrate in a ...