Huawei's new Mate 70 phone chip shows no major redesign, TechInsights says
Huawei's new Mate 70 smartphone contains a chip whose design shows only an "incremental improvement" over its predecessor and ...
Huawei’s Mate 70 Has Older Chips Than Expected
Intel's CFO, currently one of its interim CEOs, says Intel is already separating its manufacturing business' finances from ...
Huawei’s new Mate 70 smartphone chip is ‘not a major redesign’, teardown report finds
The findings contradict enthusiasm on Chinese social media, where users claimed the new Kirin 9020 had a performance boost of ...
Huawei's new Mate 70 phone chip shows no major redesign: Report
Huawei Mate 70: "The Kirin 9020 processor is not a dramatic redesign but rather an incremental improvement over its ...
Chip inside Huawei Mate 70 may surprise you, it's not what we expected
The Huawei Mate 70 chip is not what you think. A recent teardown has revealed it's not a 5nm chip that was rumored.
techxplore2 天
Huawei's new Mate 70 phone shows its chip advances are stalling
Huawei Technologies Co.'s latest flagship smartphone is powered by a chip little different from the one that set off alarm ...
腾讯网1 天
华为Mate 70 Pro+引国外机构侧目 麒麟9020芯片遭拆解分析
近日，产业研究机构TechInsights公布了对华为最新旗舰手机Mate 70 ...
中時新聞網2 天
华为新款Mate 70採用5奈米？权威机构拆解爆惊人发现
陆厂华为Mate 70系列旗舰手机12月4日正式开卖，其搭载最新1代处理器「麒麟9020」备受外界关注。研究公司TechInsights表示，华为Mate 70搭载的晶片，其设计只比上一代产品略有改进，同样是採用7奈米技术制造。TechIns ...
Lianhe Zaobao18 小时
华为Mate 70仍采用七纳米晶片 未攻克五纳米技术难关
独立分析显示，华为最新推出的Mate 70系列旗舰机所采用的晶片与前一代手机几乎一致，显示这家中国科技巨头的半导体技术进展停滞，五纳米晶片的技术难关尚未攻克。 据彭博社星期四（12月12日）报道，咨询公司TechInsights研究人员对Mate ...
TechInsights拆解确认：麒麟9020是增强版麒麟9010
TechInsights称，麒麟9020处理器并不是一次戏剧性的重新设计，而是对其前身麒麟9010的逐步改进。这表明，海思专注于改进其现有设计。
腾讯网2 天
华为Mate 70系列性能小步快跑 芯片功耗更强
华为Mate 70系列在性能上相较Mate 60系列，有了较大幅度的提升，光是跑分成绩就有了30%的提升幅度。再加上HarmonyOS NEXT系统的底层优化支持以及插帧技术的使用，至少Mate 70系列的性能表现不至于成为短板。
华为Mate 70 Pro+拆解揭秘：麒麟9020实为麒麟9010增强版
华为Mate 70 Pro+搭载的麒麟9020处理器近日引发了广泛关注。产业研究权威机构TechInsights在对该机型进行拆解分析后，揭示了麒麟9020与麒麟9010之间的微妙关系。 据TechInsights透露，麒麟9020并非如外界早前猜测的那样是麒麟9010的“超级增强版”，而是基于麒麟9010的进一步优化版本。两款芯片在制造工艺上并未发生显著变化，但在封装标记上却保持了一致性，比如都 ...