Since most III-V devices require the exposure of buried layers for metal contact formation and/or the formation of mesa structures for electrical isolation from adjacent devices on the same wafer ...

What is ALE? Etch, the process step that removes materials from the wafer to create the features of a device, is split into two categories—wet and dry. Wet etch uses liquid chemicals to remove ...

NexGen Wafer Systems is excited to announce the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean applications. SERENO combines high performance with exceptional ...

Wet etch photolithography wafer based technology. Convex and concave, spherical and aspherical, one-side or double side microlens arrays and microlenses, hexagonal, square, orthogonal, rectagonal, ...

3) Si wet and dry etching: Si wet etching is the processing wafers by selectively dissolving them using chemicals (etchant). Si dry etching is the processing wafers using high-vacuum plasma.

[See More] Capabilities: Dry Etching (Plasma / RIE); Inspection / Testing; Plating; Oxidation / Doping; Packaging / Backend Processing; Photolithography; Metallization - Thick Film; Wafer Bonding; Wet ...

The etching and characterization room contains a suite of tools for dry etching and characterization of samples. This includes three dry etchers with a range of capabilities, while characterization ...

2. Etching: Etching refers to the removal of material from the wafer surface. There are two main types of etching: Wet etching: Wafers are immersed in an etchant solution (mixture of chemicals). A ...