Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach, in its first ...

Yole said back-end semiconductor equipment market faces short-term decline but anticipates recovery with adoption of advanced packaging techniques, where it outlines below points: The back-end ...

Semiconductor faced a tough 2024 but is poised for significant growth in 2025 and beyond. Read why I remain very bullish on ...

Both the front-end and back-end semiconductor equipment segments are contributing to the market expansion. The wafer fab equipment segment, which includes wafer processing, fab facilities, and ...

In terms of the development of back-end processes and chiplet integration technologies, the Ministry of Economy, Trade and Industry and New Energy and Industrial Technology Development ...

Foreign companies are expanding capacity in Vietnam for testing and packaging chips while domestic firms are eyeing ...

Cohu, Inc. engages in the provision of back-end semiconductor equipment and services. It offers test and handling capital equipment, interface products, and related services to the semiconductor ...

He cited companies in Singapore expanding their operations into Malaysia as an example, where the front-end of the semiconductor process is mainly done in Singapore, with mid- to back-end ...