Wafers are transported between stages in the EFEM and cleaning module. In the grinding module, the wafers move from rough grinding to finish grinding as the index table rotates.
In the development project "Fully Automated Grinding Equipment for Through-Si Via Wafers" of the Japan Science and Technology Agency's (JST) Adaptable and Seamless Technology Transfer Program ...
Working alongside Siemens Gamesa Renewable Energy, our team developed a robot designed to traverse wind turbine blades and perform precision grinding operations to improve the safety and efficiency of ...
"Basics of the Cylindrical Grinder" provides a comprehensive introduction to different types and components of cylindrical grinding machines and methods such as plunge grinding and traverse grinding.
SAINT-GOBAIN ABRASIVES will be exhibiting a range of abrasive grinding products and technology at IMTS 2024, booth 237042, including the Norton RazorStar™ belts, quick-change and fiber discs with an ...