Semiconductor Engineering1 年
The Impact Of Channel Hole Profiles On Advanced 3D NAND Structures
In a two-tier 3D NAND structure, the upper and lower channel hole profile can be different, and this combination of different profiles leads to different top-down visible areas. The visible area is ...
来自MSN5 个月
制造400层3D NAND，存储大厂将引入低温蚀刻技术
该技术允许在更低温的环境下进行蚀刻，从而使存储器的存储单元间的存储通孔（memory hole）以更快 ... 制造400层以上堆叠的3D NAND闪存芯片。